The Challenge

Defects Driven by Process Imbalance & Thermal Exposure

Within six months, the defect rate for the advanced sensor assembly line increased from 0.8% → 2.5%. The most frequent issues were: Solder bridges, Solder voids, Weak/incomplete solder joints.

Why This Happened (Root Reality): Our investigation revealed a systemic workflow issue: Solder-pasted boards were left idle for too long before entering the reflow oven (often 12–25 minutes), far beyond the recommended 3–5 minute window.

As a result:

• Solder paste partially dried
• Flux activation timing deteriorated
• Paste viscosity changed due to room temperature and humidity
• Oxidation increased on exposed pads
• Contaminants accumulated on open PCBs
• Melting behavior became inconsistent

This created a perfect environment for bridges, gaps, blowholes, and insufficient wetting, severely impacting First Pass Yield. The imbalance originated from uneven cycle times across stations, bottlenecks, and inefficient WIP movement.

The AEM Solution

Line Rebalancing to Prevent Solder Paste Drying

We approached the issue by completely restructuring the assembly line to prevent solder paste from exceeding its optimal exposure window. Our first focus was on eliminating the excessive idle time between solder paste application and reflow soldering the primary driver of solder bridges, voids, and weak joints.

• Through a comprehensive cycle-time study, we rebalanced the line by redistributing tasks and aligning station cycle times with takt requirements.
• This ensured that every solder-pasted PCB reached the reflow oven within a controlled duration of less than three minutes, allowing the flux activation window to remain intact and preventing paste drying, oxidation, or viscosity changes.
• The assembly process transformed from an uneven, stop-and-go system into a continuous, predictable flow.

Standardized Work & SOP Reinforcement

We approached the issue by completely restructuring the assembly line to prevent solder paste from exceeding its optimal exposure window. Our first focus was on eliminating the excessive idle time between solder paste application and reflow soldering the primary driver of solder bridges, voids, and weak joints.

• Operators were retrained and certified to follow a unified, precise sequence of steps that reduced inconsistency across shifts. This move ensured that human factors no longer contributed to soldering instability.
• Additionally, the workflow layout itself was redesigned with Lean principles, incorporating FIFO lanes, clearly defined WIP limits, and ergonomic workstation positioning to minimize unnecessary movement and prevent accumulation or stagnation of boards along the line.

Real-Time Visual Management System

We also introduced real-time visual management to maintain process discipline. Time-exposure monitors were placed at critical points to track how long each board had been waiting, triggering alerts whenever a PCB approached the maximum allowable open time.

Takt-time boards displayed cycle deviations instantly, enabling supervisors and operators to correct issues before they escalated. With these controls in place, the line team could quickly identify bottlenecks, manage WIP proactively, and ensure that solder paste exposure remained stable throughout all conditions.

Workflow Redesign Using Lean Principles

Because defect patterns varied between shifts, the client needed a robust communication loop. AEM established daily shift-change huddles, standardized pass-down logs, and cross-shift operator rotations. These measures helped eliminate practice differences between teams and ensured consistent process execution. Combined with new visual dashboards showing real-time defect trends, the workforce developed a shared understanding of expectations and performance, striking a strong alignment between quality, timing, and workflow rhythm.

Together, these interventions created a tightly controlled, highly stable soldering process. The line now operates with balanced cycles, disciplined flow, uniform operator behavior, and precise process timing—resulting in a dramatic reduction in defects and a sustainable foundation for long-term operational excellence.

Outcome Summary

Through deep data analytics, thermal exposure control, line balancing, and standardized work implementation, AEM Consultancy (Analyze . Eliminate . Maximize) helped the client:

• Restore soldering reliability
• Build a stable, predictable, continuous-flow assembly line
• Reduce cost impact driven by defects
• Protect their reputation with medical & aerospace OEMs
• Create a sustainable, long-term quality control system

The operation now functions with high stability, minimal variation, and tightly controlled soldering performance—reinforcing the client’s position as a trusted Tier 1 supplier.