Analyze: See the costraints from design to dock

"We build a 360° view across product, process, and supply to qualitfy loss and risk."

What We Assess:

• • Supply & Planning Risk: Long‑lead IC exposure, single‑source BOM items, supplier lead‑time variance, finite (constrained) planning vs infinite MRP, shortage heatmaps
  • NPI Readiness & Governance: DFx (DFM/DFA/DFT) gaps, test‑point access, ECO cadence/latency, BOM stability and AVL robustness
  • Yield Waterfall & Test Strategy: ICT/AOI/FT yields, first‑pass yield, coverage gaps (boundary scan, ISP, functional load coverage), defect Pareto (solder bridges, voids, opens)
  • ESD & Handling: Flooring/grounding audits, wrist‑strap/ionizer compliance, handling/packaging standards, audit trail
  • Counterfeit Exposure: Sourcing channels, pedigree documentation, incoming inspection depth (X‑ray/decap risk‑based)
  • Flow & Balance: SMT cycle times, AOI bottlenecks, takt vs work content, changeover (SMED) losses, rework WIP and queue time
  • Field & Financials: DPPM/RMA trends, COPQ, premium freight incidence, C2C drivers (DIO/DSO/DPO)
  • Compliance & Traceability: Serialization, label/data integrity, RoHS/REACH documentation, PFMEA/Control Plan status

Outputs:

Constraint map from design → supply → line → test → field, KPI baseline (yield, DPPM, RMA, line balance loss, C2C), loss tree with quantified improvement potential

Eliminate: Remove stoppages, defects, and variability at source

"With root causes clear, we implement proven interventions that stick in production."

Typical interventions:

Supply Risk & Authenticity

• • Dual‑sourcing & AVL expansion for critical ICs/passives; safety‑stock policies for long‑lead parts
  • Risk‑based incoming inspection (X‑ray, decap for high‑risk lots), strict pedigree (authorized distributors, COC/traceability)
  • Finite, constraint‑aware planning; shortage escalation and pre‑kit verification

Process & Yield

• • Solder process optimization (stencil design, paste volume control, reflow thermal profile, panelization & copper balance)
  • Test strategy upgrades (add/better ICT points, boundary scan, focused FT), golden unit management, debug standard work
  • AOI/AXI program tuning; parallelization to remove AOI bottlenecks; error‑proofing (poka‑yoke) at feeders/fixtures

ESD & Handling

• • Full ESD control program (flooring, wrist straps, ionizers, monitors, audits), packaging & flow discipline
  • Workmanship training (IPC‑A‑610/J‑STD‑001) and certification refresh cycles

NPI Governance & Change Control

• • Stage‑gate with DFx checklists; earlier BOM freeze; ECO windows and impact assessments
  • Early supplier involvement (ESI) and PLM hygiene to prevent late churn

Rework & Changeover Reduction

• • Defect‑focused PFMEA/Control Plan updates; repair limits and triage flow; SMED to cut model changeover loss

Outputs:

Higher first‑pass yield, fewer line stops, reduced rework WIP, authenticity assurance, lower ECO‑driven turbulence, and stabilized takt

Maximize: Scale reliability, velocity, and cost advantage

"Once the system is stable, we lock in gains and expand capacity without expanding cost."

Value levers:

Predictive Supply & Buffering: Lead‑time watchlists, decoupling points/postponement, VMI/kanban with key suppliers

Throughput & OEE: Dynamic line balancing, parallel AOI/AXI capacity, constraint‑focused maintenance, visual management

Accelerated NPI: Digital thread (CAD->PLM->MES), rapid fixture readiness, prototype‑to‑pilot learning loops, yield ramp playbook

Test & Quality Economics: Optimize coverage vs cost, reduce over‑test while preventing escapes, closed‑loop RMA->FMEA updates

Traceability & Compliance at Scale: Unit‑level serialization, MES dashboards, automated traveler and label integrity

Cash‑to‑Cash Improvement: Inventory right‑sizing, premium‑freight avoidance playbooks, DPO negotiations aligned to risk tiers

Outputs:

Sustained yield and OEE uplift, lower DPPM/RMA, faster and cleaner ramps, improved C2C, and a supply base that bends, not breaks under volatility.